SHI-WEI RICKY LEE, Ph.D. (2025) 
Editor-in-Chief
Chair Professor of Mechanical & Aerospace Engineering
The Hong Kong University of Science & Technology
Clear Water Bay, Kowloon, Hong Kong
P: +852-23587203
E: rickylee@ust.hk
 

ASSOCIATE EDITORS
  • Damena D. Agonafer, Ph.D. (2026)
    University of Maryland College Park, USA
  • Kuo-Ning Chiang, Ph.D. (2025)
  • National Tsing Hua University, Taiwan
    Sukwon Choi, Ph.D. (2024) 
  • The Pennsylvania State University, USA
    Ercan M. Dede, Ph.D. (2024)
  • Toyota Research Institute of North America, USA
  • Wei Li, Ph.D. (2027) 
  • Zhejiang University, China
  • Amy Marconnet, Ph.D. (2025)
    Purdue University, USA
  •  
 
  • Sreekant V. J. Narumanchi, Ph.D. (2024)
  • National Renewable Energy Laboratory, USA
  • Ming-Yi Tsai, Ph.D. (2024) 
    Chang Gung University, Taiwan
  • Willem van Driel, Ph.D. (2024) 
    Signify,  The Netherlands
  • Ronald J. Warzoha, Ph.D. (2024) 
    United States Naval Academy, USA
  • Jin Yang, Ph.D. (2025)
    Samsung Semiconductor, Inc., USA

ELECTRONIC & PHOTONIC PACKAGING DIVISION Executive Committee
  • Baris Dogruoz
    Chair

OFFICERS OF THE ASME
  • Thomas Kurfess 
    President
  • Thomas Costabile
    Executive Director
  • John Goossen
    Secretary/Treasurer
PUBLISHING STAFF
  • Colin McAteer
    Managing Director, Publishing
  • Erica Hodge
  • Production Coordinator
PAST EDITORS
  • Peter Engel
  • Ephraim Suhir
  • Bahgat Sammakia
  • Y.C. Lee
TECHNICAL COMMITTEE ON PUBLICATIONS AND COMMUNICATIONS
  • Jian Cao
    Chair
  • Shapour Azarm 
    Vice-Chair
  • Beth Winklestein 
    Chair, Board of Editors

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