Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.

News & Updates

2022 Awards Call for Nominations

The EPPD is soliciting nominations for its 2022 Awards. Please review the details and consider nominating your deserving colleagues. Deadline for all nominations is September 9, 2022.

K-16 Outstanding Early Faculty Career in Thermal Management Award AND K-16 Graduate Student Paper of the Year Award

EPPD Awards

Excellence in Mechanics
Women Engineer
Early Career Engineer
Student Member of the Year

K-16 Clock Award

Call for InterPACK 2022 Papers for a Special Issue of the ASME Journal of Electronic Packaging

InterPACK is a premier international forum for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging and micro/nano-electromechanical systems. It is also the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The Journal of Electronic Packaging (JEP) publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, thermal, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Authors are invited to submit their manuscripts by March 31^st 2023, revised from their original conference papers to be considered for the Special Issue.

More information and important dates

FY 25 Member At Large, EPPD Executive Committee

The Executive Committee of the Electronic and Photonic Packaging Division (EPPD) is seeking nominations for a new member-at-large committee member. The Member- at-Large elect shall commit to serve for a five-year term with annual rotation through the Committee leadership succession. The 2024 Member-at-Large should be from academia/government/national laboratories.

Learn more about the position and nomination process

The prestigious InterPACK Achievement Award is being elevated to an ASME society level award and is being renamed as the Avram Bar-Cohen Memorial Medal. The medal is to honor a distinguished member of the electronic packaging community, Prof. Avram Bar-Cohen. In keeping with tradition, the award will continue to be given to a single individual at each InterPACK Conference. The same format will continue for this year’s award with the winner to be announced prior to the InterPACK 2022 Conference, to be held in Garden Grove, CA, USA during October 25-27, 2022.

The Call for Nominations is open. The deadline to submit is July 17, 2022. Download the flyer for complete details.

Avram Bar-Cohen Memorial Medal Call for Nominations

About

The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.

Leadership

Baris Dagruoz
Chair | July 2023 - June 2024

Sreekant Narumanchi
Vice Chair | July 2023 – June 2024

Jin Yang
Treasurer | July 2022 – June 2024

Ankur Jain
Secretary | July 2022 - June 2024

Przemslaw Gromala
Member at Large | July 2023 - June 2024

Seungbae Park
Past Chair | July 2023 – June 2024

Barbara Zlatnik
Staff Contact

Events

Featured Event

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Holiday Inn San Jose - Silicon Valley
San Jose, CA
October 8–10, 2024

Past Events

InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
San Diego Mission Valley, San Diego, CA, October 24–26, 2023

Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA, October 25 - 27, 2022

InterPACK 2021
Virtual, Online
October 26 - 28 2021

InterPACK® 2020
Virtual, Online
October 27 - 29, 2020

InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019

Honors & Awards

Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.

Society Awards:

Division Awards:

Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation.
Mechanics Award
For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
Women In Engineering Award
To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
Young Engineer Award
To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
Student Member of the Year Award
To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.
K-16 Clock Award
(Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics

Nominations link for processing division awards

Unit Award Nominations

ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards:
1. EPPD Excellence in Mechanics Award
2. EPPD Women Engineer Award
3. EPPD Early Career Engineer Award
4. EPPD Student Member of the Year Award

Download the Call for Nominations Flyer

Call for Nominations

The Allan Kraus Thermal Management Medal, recognizes an individual who has demonstrated
outstanding achievements in thermal management of electronic systems and his or her commitment to
the field of thermal science and engineering.
The Medal Recipient will be recognized during InterPACK 2024, Holiday Inn San Jose - Silicon Valley
San Jose, CA, October 8–10, 2024

Download the Flyer for all the details

2024 Avram Bar-Cohen Award Call for Nominations

The prestigious InterPACK Achievement Award has been elevated to an ASME society level award and renamed as the Avram Bar-Cohen Memorial Medal. The medal is to honour a distinguished member of the electronic packaging community, Prof. Avram Bar-Cohen.

Nominations are solicited for the 2024 Avram Bar-Cohen Memorial Medal. Candidates must have demonstrated excellence over years and international recognition in the areas of research and development related to electronic packaging. They must also have a high level of service accomplishments to the technical community at large.

For more information about the nomination process, download the flyer

Nominations are solicited for the 2023 Avram Bar-Cohen Memorial Medal. Candidates must have demonstrated excellence over years and international recognition in the areas of research and development related to electronic packaging. They must also have a high level of service accomplishments to the technical community at large. Scientific and technical leadership is demonstrated by multiple means, including but not limited to publications, patents, technology and product development, and academic advising.
Nominations are due March 17, 2023. The winner will be recognized during InterPACK 2023, October 24 - 26, San Diego, CA. Download the call for nominations flyer for all the details including criteria, submission instructions and past winners.

Call for Nominations flyer

Call for Awards Nominations

Deadline: July 21, 2024, 5:00 PM PST
ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards:
1. EPPD Excellence in Mechanics Award
2. EPPD Women Engineer Award
3. EPPD Early Career Engineer Award
4. EPPD Student Member of the Year Award
Review the Awards Flyer for more information including submission process.

EPPD Call for Awards Nominations Flyer

ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the K-16 Clock Award. The K-16 Clock Award is an annual award which is typically given every other year to the outgoing K-16 Committee Chair. Given 2024 is an off-year (no outgoing K-16 Chair), this year’s awardee will be selected based on technical excellence as well as service to the community. Additional details are provided on the Call for Nominations flyer.

K-16 Clock Award Call for Nominations

In order to acknowledge and recognize exceptional efforts from individuals and groups that have strengthened the Heat Transfer in Electronic Equipment Community, the ASME K-16 Leadership in collaboration with EPPD and HTD is pleased to announce that it is accepting nominations for the 2023 K-16 awards. The deadline to submit is December 8, 2023.